A year after founded in 1996, Pacific Wave specialized in providing various In-Building RF Component. We place particular emphasis in quality, fast delivery with competitive price thus our products are ideally suit towards Telecommunication Industry Needs.
Our Splitter/Coupler/Combiner are all Low Inter-modulation design, housing/boxes are machined using high quality Aluminum with silver plated. Connectors are high quality European manufactured with special Low IM plating. Our Internal strip-line circuit are all manufactured using high temperature Teflon printed circuit board material specially fixed to the box to ensure excellent longevity even in extreme circumstances.
Currently, our RF Passive Product range has include :
- In-Building Antenna : (click here for detail)
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Splitter / Power Divider : (click here for detail)
Our Splitter is small, Wideband (800-2700Mhz), medium Power (100Watt) and High Power (300Watt) with Low Inter-Modulation on its class.
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Coupler/ Uneven Power Splitter : (click here for detail)
Our coupler is small, wideband (800-2700Mhz), high Power Handling (200Watt) and deliver the best Inter-Modulation on its class. We have full range of Power Coupler which make RNP easy to design the RF Link Budget.
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3dB Hybrid Coupler : (click here for detail)
Our 3dB Hybrid coupler can be used : as a decoupled splitter, or decoupled combining of two transmitters or two receivers with narrow frequency spacing, or for decoupled combining of two receiver/transceiver module which are within the same frequency.
- In-Building Combiner : (click here for detail)
- Various In-Building Jumper Cable : RG8, RG214/U, RG223/U, RG142/U.
- Various Attenuator and Terminator/Load.
Beside passive components, we also provide In-Line Amplifier with 2 different characteristic : LA series : Single Band Amplfier, light and Low Output Power (upto +33dBm) with no alarm monitoring and Multiband_Inline_Amplifier(MIA) : High Output Power (+33 or +37dBm) with alarm System & Monitoring Feature. In-Line Amplifier is useful for Link Budget at huge In-Building Network Design to improve Signal strength with low uplink interference. This is possible as LA methodology is deliver additional gain towards downlink with a sufficient gain towards uplink
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